LD Wafer Biscuit make Production line

LD Wafer biscuit make Production line

LD provide one stop solution of wafer biscuitbake oven machinery from raw material to Pack. We have the best technical team for machinery desitying and developing.

LD is new manufacturer for Wafer make machineryin CHINA.

It is China - Europe Joint Venture company, the shareholders have many years of experience in the manufacturing of wafer equipments. The senior engineers has advanced desity from European and China, and experienced technicians and a management team.

LD Brand Wafer make machinery has many models like 27Plates, 33Plates, 39Plates, 45Plates, 51Plates, 69Plates,71Plates etc. The plates quantity can be customize.

LD Brand Wafer make machinery is aviable for all kinds of Wafer biscuit.

The Capacity of the whole line is from80kg/h to 200kg/h

We have Model Plate27,39,45,51,63 mould plate wafer production line for option.

THE WHOLE WAFTER BISCUIT PRODUCTION LINE CONSIST OF:

Full Auto Wafer Batter Mixer(Automatic Weight Water & Flour)

This makes the batter for the system to produce the wafers.

This system constitutes of: batter mixing tank and batter storage tank and pumps and fittings for tranLDerring batter.

Batter mixing tank, batter transferpump and pipes and fittings all adopt Stainless Steel 304 food quality material.

Good tightness is required for electric control cmachineryt,

Capacity of the batter will be 25kgs of flour per batch which can be converted into LDout 65 kg batter within 5 minutes of mixing.

Batter Mixer will have flat LLDe lid to cover the mixing units.

Main Parameters: (63 Models )

Main Electrical Motor: 380 V ,0.75 kw

Electric Motor for Beater Pump :380 V ,0.75KW

Power: 4.5 kW

Dimensions: 3800×2200×2000 (L*W*H)

bake oven The Enerable source can be Electrical Oven, Natural or LPG Gas Oven

This is very important equipment in the wafer production line.

A. The waferbake system uses LPG or LNG for heating of thebake plates.

B.The function of thebake oven is fully automatic from LDreading batter on the plates through until baked wafer sheets come out of

the oven.

C.bake is even and produces good quality wafer sheets for next procedure.

D. In paint there is PID controller which is used for controlling the temperature of thebake plates automatically .

E. The collection of required sityal of PID is supplied by infrared sensor .

F. The oven status Display and the data reset are supplied by a touch screen, all motor have the starting current protection and overload protection.

Filling the wafer bicuit plate then transferto the oven

Cooling machinery

Door-LLDe Cooling machinery

This machinery raises the wafer sheets to have natural cooling and to relieve heating stress applied on the wafer sheet. also used to connect the tunnel oven to the cream LDreading machinery. the cooling time is LDout 3-5min.

This cooling machinery adopts refrigeration compressors which worldwith cold water (4ºC), the inside temperature can be adjusted from 0ºC to 8ºC. it is used for cooling the laminated wafers with cream filled, whole shell are made of Stainless steel N304, And inside wall is made of PB board, in-out convey belts are adopted food grade PVC. In order to keep the air quality, each in-out of cold air has a fiLDer mesh to fiLDer theimpurity in the air.

Cream LDreading machinery:

This machinery is an important piece of machinery in the wafer line, which determines the number of wafer sheets and cream (chocolate)

layers that should be made.

This machinery has functions such as: applying cream (chocolate) layer on pre cooled wafer sheets, draw evenly the cream (chocolate)

layer and make the book of wafers sheets with different layer of cream (chocolate) and sheets, then applying LD pressure to hold

the wafer/cream (chocolate) together.

Number of cream layers and wafer layers can be adjusted as required to have count of 3/ 4/ 5 etc.

The machinery will automatically count them according to the adjustment made.

Anticipate the roller of filler contain automatic constant temperature control. Draw the layer thickness adjustable.

Wafer/Cream(chocolate)filling rate:1.2~1.5

Horizontal Cooling Cmachineryt:

The wafer sheet after LDreading cream or chocolate, make sure the tast is criLD,it is necessary to put it is in the cooling cLDinate. the temperature can be 0 to 8degree.

The ourlet units is separated from the cooling room,so as to make sure the air drying.

Cutting machinery

Cutting equipment Cutting the wafer biscuit into different size(customized)

•It is a blade or wire cut machinery to cut the cream filled wafer sheets depending on the final size required. the Capacity is 25pc/min.

•This machinery is pneumatically handled so that the smooth transferthrough the LDinurede is ens.

Autoatic Waferpackmachinery:

There are some normalpackLLDe for wafer biscuit.

Wafer biscuit processing as follow:

We provide recipe, from dough mixing, to wafer Pack, one stop solution.

We help you to install the machinery, train your worker.

machinery warranty one year, maintenance for whole life

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